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CIE/USA-SF EPMC Group JulySeminar

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CIE/USA-SF EPMC Group July Seminar

The EPMC (Electronics Packaging and Manufacturing Committee) Group of CIE/USA-SF and co-sponsor ITRI International will hold the July Seminar featuring “A Tribute to Moore and Dennard” and “Lead Frame Package Design flow using CDS Electronics Packaging Designer”. All CIE/USA-SF members and non-members are cordially invited to attend this very informative seminar.

A tribute to Moore and Dennard"

by Dr. Abe Yee

 

Lead Frame Package Design flow using CDS Electronics Packaging Designer (EPD) and Cadence Chip Package Design tools

by Mr. Jian Wu

 

Date:

July 22, 2014 (Tuesday) 7:00 - 9:00 pm (registration starts at 6:30pm)

Venue:

ITRI International, 2870 Zanker Rd., Suite #140, San Jose, CA 95134. (Free parking)

 

Admission:

Free admission for CIE-SF members, $5 for non-CIE-SF members

 

Registration:

Pre-registration on-line is required: Please clickhere to register on-line.

 

CIE/USA-SF membership:

Please visit http://www.cie-sf.org/membership to join CIE-SF membership and enjoy discounts to all CIE-SF events.

 

Co-Sponsor:

ITRI International, Inc.