[Press Release, San Jose, CA. 9/10/2010] CIE-SF (Chinese Institute of Engineering, San Francisco Chapter) will host a
2010 Fall Short Course event at San Jose State University during 9/25, 10/2, 10/9, 10/16 four Saturdays. The contents
of short course cover both the cutting edge technologies and the most important career skills for striving in work places.
This year CIE-SF has invited totally 7 speakers to give lectures on the topics of
1) Leadership and Strategy Execution for Engineers
2) Introduction to Android Product Development
3) Clean Technology: An Overview
4) Smart Grid - What it is and what it would mean to me
5) The Challenges of 3D IC Packaging
6) Soft Skills: What they don't teach you in Engineering Schools
7) Introduction to Mobile Programming.
As the past short courses, this year CIE-SF has invited short course speakers from both industries and academies
with years of expertise in each area. They are: Prof. Ted Selker, Mr. Vincent Wang, Dr. Michael Hsieh, Dr. William Kao,
Mr. Andy Tseng and Dr. Chris Lin.
This is the 8th year CIE-SF and San Jose State University host the short course event. In the past, each short course has
drawn hundreds of attendances and received huge amount of positive feedback and popularity. CIE-SF short courses feature
the condensed contents in three hours of lecture taught by the experts in the area to give introductory knowledge to
practical workshop experiences. For this year short courses, we have are very excited to cover the areas in the next
generation technologies and skills lead to career success. Android/Mobile computing will be the most popular and
important S/W development area in the next decade. With the green house effect leading to global climate change,
green technologies are essential for human to create a harmony with our environment. IC packaging has been evolved
from 2-D to 3-D and pose a great deal of challenges ahead. Career management and soft skills are as important as
technical skills to climate up corporate ladders for long term engineering career planning.
Both
Mediatek and
Mobicase
have provided sponsorship to CIE-SF Fall Short Course this year and that makes the free admission for student attendees
possible. As non-profit organization and a way to give back our community, CIE-SF Fall Short Courses will charge $20 for
CIE-SF members and $30 for non members per each course day. For details of the event, please go to link: http://www.cie-sf.org
9/25/2010, 10/2/2010, 10/9/2010 and 10/16/2010 (Saturdays)
CIE/USA-SF Chapter and co-sponsor San Jose State University announce the year 2010 Fall Short Courses covering
Android S/W Platform, Mobile Programming, 3D-IC Packaging, Clean Energy Technology, S/W Management and Soft Skills.
Seven classes will be taught by renowned industry experts on 9/25, 10/2, 10/9, 10/16 of 2010 at SJSU. The courses
are designed to give an introductory level of various EE fields and general career skills. All lecturers are academic
or industrial renowned experts in the field.
To Print this Short Course announcement, please download this file
CIE ShortCourse2010combine final.pdf
CIE/USA-SF and SJSU Course Titles:
Fee:
- Member: $20/Course Day, Non member: $30/Course Day.
- Students are free - must present valid student ID at class and register online
at http://ciesf-student.eventbee.com .
Pre-registration on-line is required:
Please visit CIE-SF website: http://www.cie-sf.org/ or
http://ciesf.eventbee.com to register.
Location:
San Jose State University,
Engineering Building Auditorium (Eng189), (Engineering Building is located on
San Fernando St., between 7th and 8th street).
Please see map:
http://www.sjsu.edu/about_sjsu/docs/SJSU_campus_map.pdf
Parking:
Free weekend parking is available at the
4th Street Garage (at 4th Street and San Fernando Street).
Event Sponsors:
Leadership and Strategy Execution for Engineers
Mr. Vincent Wang
Abstract
We hear leadership all the time, but how does it fit in engineer roles? Strategy sounds like an MBA terminology, but how
does it affect our engineer works? What does it mean to us in today's dynamic organization and global environment? In this
course, we will look into what leadership really means to us and how strategy execution addresses the crucial role in
achieving our better performance in our organization. We will obtain a clear understanding of the leadership role and
how best to use it strategically. We will learn how we can be an effective leader, whether for making strategic decisions,
translating strategy, assessing risk, establishing sponsorship and managing change within our engineering works or our
daily life. We will talk about how to use a simple framework to help us reach this goal easily.
Biography
Mr. Vincent Wang is a software engineer at Google. At same time, He is also doing study and research in Software
Management at Carnegie Mellon University. Prior to Google, he worked at Cisco Systems, Nortel Networks, Sun Microsystems,
AT&T Bell Lab. He has 15+ years experiences in system and business software development, network equipment development,
and project and product managements. He also has 8+ years experiences in teaching in Computer Science, Networking and
Internet Application Developments.
Introduction to Android Product Development
Dr. Ted Selker
Abstract
Prof. Selker will introduce the CMU Silicon Valley graduate programs and run a workshop on Android Product development.
This project workshop will begin with as an introduction to creating Android phone applications. We will discuss the merit
and approach to using eclipse to generate android applications. We will give you a way to test and explore the sensors and
UI options in an Android and will describe some of the applications made in a 5 week Android /product development course at
CMU Silicon Valley which created 17 applications.
The workshop will also discuss design discussion of how to generate and test ideas. How to turn them into solutions and
how to evaluate them. Participants in this workshop should come prepared explore and discuss ideas that will become the
future of mobile applications.
Biography
Dr. Ted Selker is Associate director of mobility research at Carnegie Mellon Silicon Valley and a visiting scholar at
Stanford computer science department. He is well known as a creator and tester of new scenarios for working with
computing systems. Ted spent ten years as an associate Professor at the MIT Media Laboratory where he created the
Context Aware Computing group, co-directed the Caltech/MIT Voting Technology Project, and directed a CI/IDI: kitchen
of the future/ product design of the future project. His work is noted for creating demonstrations of a world in which
intentions are recognized and respected in complex domains, such as kitchens, cars, on phones and in email. Ted's work
takes the form of prototyping concept products supported by cognitive science research.
His successes at targeted product creation and enhancement earned him the role of IBM Fellow and director of User
Systems Ergonomics Research. He has served as a consulting professor at Stanford University, taught at Hampshire,
University of Massachusetts at Amherst and Brown Universities and worked at Xerox PARC and Atari Research Labs.
Ted's innovation has been responsible for profitable and award winning products ranging from notebook computers to
operating systems. For example, his design of the TrackPoint in-keyboard pointing device is used in many notebook
computers; his visualizations have made impacts ranging from improving the performance of the PowerPC to usability
OS/2 ThinkPad setup to Google maps, his adaptive help system has been the basis of products as well. Ted's work has
resulted in numerous awards, patents, and papers and has often been featured in the press. Ted was co-recipient of
the Computer Science Policy Leader Award for Scientific American 50 in 2004, the American Association for People
with Disabilities Thomas Paine Award for his work on voting technology in 2006 and the Telluride Tech fest award in 2008.
Clean Technology: An Overview
Dr. William Kao
Abstract
In his address to Congress on Feb 24, 2009 President Obama said, "We know that the country that harness the power of
clean, renewable energy will lead the 21st century."
The importance of Clean Technology and Renewable Energy will be paramount for the next two to three decades, and many
countries besides US including China, Japan, and the EU are all focusing on clean technologies like solar and wind
energy, smart grid and green transportation (electric vehicles and high speed rail).
In this short course Dr. Kao will give an overview of Clean Technology including: the seven kinds of Renewable Energy,
energy transmission and distribution ( smart grid ), energy storage technologies, Green Building (LEED, LED lighting and
biomimicry), and Green Transportation ( electrical vehicles, PHEVs, and HSR). He will also discuss some technical
and financial challenges ahead as well as new business opportunities in various clean /green technology areas.
Biography
Dr. William Kao received his BSEE, MSEE and PhD from the University of Illinois Urbana-Champaign. He has worked
in the Semiconductor and Electronic Design Automation industries for 30 years holding senior and executive
(Director, VP) engineering management positions at Texas Instruments, Xerox Corporation, and Cadence Design Systems.
Dr. Kao has authored more than 40 technical papers and holds several software and IC patents. He was an Adjunct
Professor at UCLA Electrical Engineering Department where he taught courses in computer aided circuit design.
Dr. Kao is a Senior Member of IEEE, and was one of the founding members of IEEE-Circuits and Systems - Silicon
Valley Chapter, where he was Chapter Chair in 2005 and 2006.
Dr. Kao currently teaches Renewable Energy and Clean Technology courses at UC Santa Cruz Silicon Valley Extension,
and at the Silicon Valley Technical Institute in San Jose. He is also on the Technical Advisory Board for Sigma
Quest on the topics of Energy and Environment, and Quality Control, and is an advisor and consultant for several
Clean Tech companies.
Dr. Kao is currently President and Founder of CARES (Chinese American Renewable Energy Society), now The Clean Technology
Group of the Chinese Institute of Engineers (CIE) USA-SF, where he is also a Board Member.
Smart Grid -What it is and what it would mean to me
Dr. Michael Hsieh
Abstract
This talk explains the architecture of the electricity grid and the intelligence grid as well as the stack hierarchy for
an end-to-end holistic system. It also illustrates some real world value propositions, business perspectives, and
rationales from the point-of-view of business economics and technical practicalities. It is meant as an introduction for
the business professionals and a contemporary overview for technical practitioners, product developers, system managers
and urban planners.
Biography
Dr. Michael M. Hsieh calls himself a smart grid enthusiast. He has been an Instructor at UC Berkeley Extension since
summer of 2009. Prior to that, he worked at Sun Microsystems Inc. for almost 20 years where he designed and
delivered 3 generations of Sun workstations and servers and 3 generations of UltraSPARC microprocessor chips.
He also served as a mentor on Sun Engineering Enrichment and Development (SEED) program for multiple terms.
In addition, Michael has 2.5+ years experiences in Storage Area Network (SAN) switch design industry outside
of Sun Microsystems Inc.. Prior to joining Sun, Michael invested more than 7 years in designing multiple
microcontroller chips at Intel and Ford Microelectronics Inc. respectively. Michael's current interests
include the design and the realization of smart grid, smart microgrids, internet of things, and applications
for the smart and digital energy era. Michael earned his PhD in Electrical Engineering with minor in Applied
Mathematics from Texas Tech University at Lubbock, Texas.
The Challenges of 3D IC Packaging
Mr. Andy Tseng
Abstract
The Moore's law has been the powerful driver for the microelectronic industry and succeeded in delivering a scaled
technology node every 18 month doubling the density of devices per square mm and increasing the performance.
Recently Moore's law hit the brick walls due to the limits of the Physical space after shrinking the technology nodes.
Therefore, semiconductor industry assemble the IC devices vertically by stacking the die using wire-bonding process,
stacking of packages such as Packaging on Packaging (POP) or Packaging in Packaging (PiP) or stacking the die by
through silicon vias (TSV) technology, which is so called the 3D IC packaging. The "More than Moore's" has been
introduced through such a 3D process and integration. The key technologies of 3D IC integration and packaging are
electrical, thermal and mechanical designs, wafer thinning and handling, stacked-die wire-bonding, POP and PiP
assembly process, TSV (through silicon via) forming and filling, assembly thermal Management. The 3D IC packaging
has the challenges during the packaging assembly. The presentation will cover the 3-D packaging challenges start
from the aspects of packaging design performance characterization, thermal, electrical and mechanical modeling,
assembly process, qualification and reliability.
Biography
Andy Tseng is currently Director of Technical Marketing at the ASE group, where he has been employed since 1994.
He plays a role as technical promotion for aQFN (advanced QFN package) and Cu wire-bonding packages. Prior to this
appointment, Andy was Director of Engineering for five years, he leaded a dynamic substrate design and packaging
application team in the US, which provided ASE customers with strong engineering support including packaging design,
thermal & electrical modeling, package assembly process and package qualification and failure analysis.
Before joining ASE Group, Andy worked for Microelectronics Technology Inc. (MTI), located in Hsinchu/Taiwan, as an
electrical hardware engineer in the Satellite Communication Design Group for digital signal processing design and
printed circuit board layout.
Andy holds a BS degree in Physics from the National Cheng-Kung University in Tainan, Taiwan. In addition, he earns an
MS degree in Physics from the Northern Illinois University in Dekalb/Illinois, as well as an MS degree in Electrical
Engineering from Santa Clara University in Santa Clara, California.
Soft Skills: What they don't teach you in Engineering Schools
Dr. William Kao
Abstract
"Hard skills" are the technical requirements of a job, what might appear on your resume -- your education, experience and
level of expertise. You learn them in Engineering schools.
"Soft skills" on the other hand, are essentially people skills -- the non-technical, intangible, personality-specific
skills that determine your strengths as a leader, listener, negotiator, and conflict mediator. While having strong
technical know how is important, persons with good soft skills are generally the people that most employers want to
hire. The ideal, of course, is someone strong in both job and personal skills. The real key to success in any job
is making your soft skills and hard skills complement each other.
This course will first cover what are the most important soft skills such as making technical presentations, how to
write technical papers or proposals, conducting effective meetings, setting priorities, be a team player, and dealing
with stress at work. Then it will focus principally on two "effective communication" skills: how to write technical
papers (written) and making technical presentations (verbal)
Biography
Dr. William Kao received his BSEE, MSEE and PhD from the University of Illinois Urbana-Champaign. He has worked in the
Semiconductor and Electronic Design Automation industries for 30 years holding senior and executive (Director, VP)
engineering management positions at Texas Instruments, Xerox Corporation, and Cadence Design Systems.
Dr. Kao has authored more than 40 technical papers and holds several software and IC patents. He was an Adjunct
Professor at UCLA Electrical Engineering Department where he taught courses in computer aided circuit design.
Dr. Kao is a Senior Member of IEEE, and was one of the founding members of IEEE-Circuits and Systems - Silicon
Valley Chapter, where he was Chapter Chair in 2005 and 2006.
Dr. Kao currently teaches Renewable Energy and Clean Technology courses at UC Santa Cruz Silicon Valley Extension,
and at the Silicon Valley Technical Institute in San Jose. He is also on the Technical Advisory Board for Sigma
Quest on the topics of Energy and Environment, and Quality Control, and is an advisor and consultant for several
Clean Tech companies.
Dr. Kao is currently President and Founder of CARES (Chinese American Renewable Energy Society), now The Clean
Technology Group of the Chinese Institute of Engineers (CIE) USA-SF, where he is also a Board Member.
Introduction to Mobile Programming
Dr. Chris Lin
Abstract
With recent advancement of mobile devices and mobile data networks, we are increasing relying on mobile devices for
business and personal use in our daily life. While early days of mobile devices were lead by Palm, Windows CE, RIM
Blackberry, and Symbian devices, recently Apple's iPhone/iPad and open-source Android devices are capturing media
attentions as well as the mobile market share. In this short course we will introduce basic programming concepts
for the open-source Android devices. We will go through the program execution model in such mobile devices, and
walk through device programming fundamentals such as user interface, application resource, intents, and storage.
The short course will not turn you into an Android expert programmer, but will expose you to the programming
principals and basic concepts in developing for such mobile devices.
Biography
Dr. Chris Lin received his Ph.D. from the University of California at Berkeley EECS department. He is currently at
VeriSign with responsibility in enterprise technology strategy and is involved in cloud security and multi-portal
eCommerce strategy. Dr. Lin was previously with Ellie Mae as VP Infrastructure and eCommerce, where he was
responsible for mission critical transaction infrastructure and also built a successful financial SaaS solution.
Dr. Lin was founder and CEO of iDini Corporation, a pioneer in providing network computing software and services
for mobile devices since 1999. He built a Shanghai R&D center for Universal Scientific Inc. in 2003, and served
in NEC America, AT&T Bell Labs, Tekenekron, IBM, and various silicon-valley startups in technical and management
roles. Dr. Lin published numerous papers in his early career and held patents in scalable software, fast
algorithm for video and image encoding, networking, and low power circuits.