CASPA / CIE Summer Symposium

 

CASPA / CIE Summer Symposium

Global Collaboration - Technology and Social Science

For Human Advancements


Date:          July 16, 2011 (Sat) 
Time:          12:00pm-06:00pm 
Venue:        Intel Headquarters SC12 Auditorium 
                   3600 Juliette Lane, Santa Clara, CA 95054 

Agenda:     12:00 - 12:45 pm    Registration & Networking 
                  12:45 -  1:00 pm    Welcome by CASPA/CIE 
                    1:00 -  3:00 pm    Session I: Social Cloud 
                    3:00 -  3:15 pm    Break 
                    3:15 -  5:30 pm    Session II: Culture Fusion 
                    5:30 -  6:00 pm    Social Network 

RSVP:          Register online by Clicking Summer Symposium Registration
Admission:   Free Admission, Free Parking, Free Refreshment 
                   Since seats are limited, only those have registered are permitted to enter. 

Session I: Social Cloud

A new technology revolution is emerging in the Silicon Valley. Social networking is creating internet traffic which in turn is pushing the cyber commerce. The impact of supporting the bandwidth, and speed to keep everyone connected in the world create a huge demand for semiconductor. The connectivity by smart phones, e-readers, and tablet PC as well as the traditional notebook and PC is now the growth engine for memory, touch sensor, WIFI, and MCU devices. Cloud computing is converging as a social and business platform for entertainment as well as information innovation. The backbone of the cloud is the infrastructure of server farms and IP security which is also source of innovation in semiconductor. The combination of social network and cloud computing will create new 21th century society where our personal life is enriched and career opportunities are expanded. 

                             

Speakers: Topics
Mr. Rory McInerney, VP Intel Intel's Vision of Cloud Computing in 2015
Mr. Mario Morales, VP IDC Analyst Enabling Technology Driving Semiconductor in Next 5 Years
Mr. Ricky Ma, Head Of Technology Cluster, Hong Kong Science Technology Park GreenTech business Opportunities in Hong Kong / China
Mr. Sunny Hui, VP SMIC-USA New Generation of Thinking of Semiconductor Technologies For Smart Devices

 

Session II: Culture Fusion

Asians have a long civilization history in their native continents and Asian immigrants have become one of the key ethnic components of the United States. Comparing to other ethnic groups, Asian Americans have taken a long way to achieve today's status, and are still actively pursuing their fair share of cultural, political and economical rights. This panel has 4 heavy weight Asian activists (Dr. Fred Hsia, Dr. Chenming Hu, Dr. Talin Hsu and Mr. Ling Wu) to discuss about the two Cultures, political and social activism, leadership and success in the main stream society. It will benefit both new comers and established Asians in the US, including the Asian engineers and the entrepreneurs. 

                             

Speakers: Topics
Dr. Frederick Hsia, Prof of Literature at NCKU, NTHU Two Cultures
Dr. Ta-Lin Hsu, Founder & Chairman H&Q Asia Pacific Development of Asian Philanthropy
Dr. Chenming Hu, Professor at UC Berkeley Political and Social Activism
Mr. Ling Wu: VP Broadvision Another Angle of Leadership



Notice of using Intel Facility: 
Parking: 
Forum parking is FREE at Intel SC9's parking garage & open space parking lot, as indicated in map. 

 
Regulation to Access Intel Facility: 
During the Forum, attendees are ONLY allowed to stay in the Auditorium and the front lobby on the 1st floor of SC12. No access to other areas of SC12 Building is permitted. SC12 will be closed after the event. Intel employees need to follow standard procedures through the security checking to go inside the building.

.

Print Email

CIE/USA-SF and ITRI 2011 Fall Short Courses

Free Lunch for Paid Attendees!!!

9/24/2011, 10/1/2011, 10/8/2011 and 10/15/2011 (Saturdays)

CIE/USA-SF Chapter and co-sponsor ITRI announce the year 2011 Fall Short Courses covering Bridge Construction, Cloud Computing, Miniaturization, IC Packaging, Solar Energy, Smart Grids, Internet of Things, and Green MBA. Eight classes will be taught by renowned industry experts on 9/24, 10/1, 10/8, 10/15 of 2011 at ITRI International. The courses are designed to give an introductory level of fundamental theory with in-depth knowledge of various engineering fields. 

To Print this Short Course announcement, please download this file CIEShortCourse2011combineRev6p0.pdf 

CIE/USA-SF and SJSU Course Titles:

Course Day

Course Name

Lecturers

Date/Time

Day 1 How the 4D technology is applied in the San Francisco Bay Bridge New Span Construction 

Reflection on Cloud Computing, Social Network and Mobile Applications: Hype or the Real Thing
Paul Wenpei Chou

Jason Yao
9/24/2011 - 9AM 

9/24/2011 - 2PM
Day 2 Designing Successful IC Packaging with System Level Interconnect and Integration Considerations

IC packaging and Board Level Reliability Test
Hong Shi

Andy Tseng
10/1/2011 - 9AM

10/1/2011 - 2PM
Day 3 Solar Energy Fundamentals: Photovoltaics and Concentrated Solar Thermal

Smart Grid Architecture and Value Propositions
William Kao

Michael Hsieh
10/8/2011 - 9AM 

10/8/2011 - 2PM
Day 4 Internet of Things in Support of Smart Grid and Smart Cities and More

Green MBA: Focus on Sustainability
Michael Hsieh

William Kao
10/15/2011 - 9AM

10/15/2011 - 2PM


Course Fee: 
* Students are free - must register on-line and present valid student ID card. 

Registration Fees On-Line Registration On-Site Registration
CIE Member $20 $25
Non-CIE Member $30 $35


Location: 
ITRI (Industrial Technology Research Institute) International Inc, 
2870 Zanker Road, Suite 140, San Jose, CA 95134, USA. 

Pre-registration on-line is required: 
Please visit CIE-SF website: http://www.cie-sf.org/ to register and for more detailed information of classes.
CIE members or non-members: please visit http://cieshortcourse2011.eventbee.com to register.
Students: please visit http://ciestudent2011.eventbee.com to register. 

Corporate Sponsors: 
   


Course Title: How the 4D technology is applied in the San Francisco Bay Bridge New Span Construction 
Course Abstract In 2002 when the construction for the new replacement structure for the San Francisco Bay Bridge started, one of the challenges was how to best fabricate the pre-casted segments in shapes matching the final geometry. We needed a streamline process to guide the design from fabrication to construction. The successful application and knowledge gleaned from the Bay Bridge design and construction demonstrates that we can achieve quality and excellence if we apply the latest procedures and technologies. 
We will explore some of these technologies in this short course. 

Speaker's Bio 
Paul Wenpei Chou is the VP of engineering at Chou's Image, Inc. He has been a bridge and highway engineer for 27 years. For most of his professional engineering career, he has led the geometry control operation for construction management support. For the last nine years, Mr. Chou has been involved with the San Francisco Oakland Bay Bridge East Span project. He is working on geometry control for precast segment form development, mass concrete structure PT reinforcement conflict detection and resolution, steel deck modeling on detail clearance verification and detail modeling for complex structural component. He is also proficient in software development and system architecture. Mr. Chou has authored several patents in early embedded applications. 



Course Title: Reflection on Cloud Computing, Social Network and Mobile Applications: Hype or the Real Thing 
Course Abstract 
Cloud computing promises a paradigm shift from existing IT infrastructures to a utility-based service model for both hardware and software. The advancement of processors, storage and network technologies accelerate the trend in recent years, and the centralized IT services should provide more convenience and better energy efficiency in either public or private cloud. Another key force pushing the adoption of cloud computing is the innovation and deployment of mobile devices. Better processing power and longer battery life improved usability and ubiquity. Cloud computing and social network are two powerful movements in the web-related business today. 

In this talk, we will summarize the background of cloud computing and review recent activities from prominent companies. Through discussion, we differentiate the hype from the real impact of this trend both locally and globally. How may cloud computing affect our daily life at a personal and professional level? From the standpoint of IT hardware providers, we will also discuss some current devices that fit the trend, examine the bottlenecks of technology and the hopes of potential breakthroughs. 

Speaker Bio 
Jason Yao is now a senior manager of business development/product management at ASUS Computer International in Fremont, California. Prior to joining ASUS, Jason held various R&D and management positions at Foxlink International, Fujitsu Laboratories of America, Fujitsu Network Communications and ATT Bell Laboratories. His research interest includes Digital Signal Processing, Audio and Video Compression, Internet Traffic Engineering, P2P Networks and Multimedia Streaming over the Internet. Jason has published more than 30 peer-reviewed journal and conference papers in these fields, and co-invented two patents related to P2P networks.

Jason holds a PhD in Electrical and Computer Engineering from University of California, Santa Barbara and an MBA degree from Santa Clara University. During 2004-2007, he was a Visiting Scholar at National Taiwan University where he conducted research and taught Computer Network/Entrepreneurship classes. Since 2008 he has been an associate professor at Silicon Valley University and taught Software Engineering, Software Quality Assurance and Cloud Computing.



Course Title: Designing Successful IC Packaging with System Level Interconnect and Integration Considerations 
Course Abstract: 
IC packaging traditionally has served as the bridge linking the density gaps between high density and delicate silicondevices to coarse and rigid printed circuit boards. With silicon technology advancing at the rate of Moore�s law, the silicon�s feature has expanded rapidly to meet system level requirements. Increasingly, the IC packaging started to serve as system integration platform. Feature-rich and cost sensitive packages require comprehensive system level design and performance considerations from floor planning to design release phase, and from product definition to production. Among the key areas of focus are: IC-Package-PCB co-design process; interconnect placement and density optimization for different level of circuitry and their interfaces; the signal integrity and power integrity of component level and system level; and cost/performance margin trade-off. This short course will allow students to establish basic concepts of system level co-design and understand their application in the new product development life cycle. 

Speaker's Bio: 
Dr. Hong Shi is a senior manager at Altera Corporation in charge of packaging designs. He has worked at Altera for over 7 years in the capacities of design engineer, electrical design manager, and packaging design senior manager. Prior to Altera, he worked in Agilent, where he led the introduction of the first 40GHz analog module in Agilent infiniuum DCA series. He has 20 years of industry and research experience in field of optoelectronics, optical fiber communication, microwave circuits, and digital circuit packaging. He has published more than 50 technical articles in various peer reviewed IEEE journals and international conferences, one book chapter, and holds 15 issued and pending patents in related fields. Dr. Shi is a frequently invited speaker in industry technical seminars and international forums. He holds a PhD in optics and photonic from University of Central Florida and MSEE, BSEE from Xi'an JiaoTong University. 



Course Title: IC Packaging and Board Level Reliability Test 
Course Abstract: 
Recently wafer technology is moving toward 28nm and 20nm technologies. With these smaller gate technologies, electronics devices are more complicated, have more I/O's (input and output) signals, and operate at higher electrical frequency inside the chip. However, the chip size is expected to grow to accommodate increased functional circuits which will generate more heat and will impact the device's long term reliability and lifespan. Without an optimized circuit design at the packaging level and board level for the electrical signal distribution and thermal dissipation, the overall system performance will be degraded. This presentation will address the IC packaging and system level design considerations and then focus on board level tests to measure and qualify the electronics system's reliability and stability. 

Speaker's Bio: 
Andy Tseng is currently Director of Technical Marketing at the ASE group. He plays a role as technical promoter for Cu wire-bonding packages. Prior to this appointment, Andy was Director of Engineering and led a dynamic substrate design and packaging application team in the US. His team provided ASE customers with strong engineering support including packaging design, thermal & electrical modeling, package assembly process and package qualification and failure analysis. 

Andy holds a BS degree in Physics from the National Cheng-Kung University in Taiwan. In addition, he earned an MS degree in Physics from the Northern Illinois University, as well as an MS degree in Electrical Engineering from Santa Clara University in California. 



Course Title: Solar Energy Fundamentals: Photovoltaics and Concentrated Solar Thermal 
Course Abstract 
Among the alternative/renewable energy sources solar energy is one of the most abundant, and therefore popular. Solar technologies use the sun's energy to provide heat, light, hot water, electricity, and even cooling, for homes, businesses, and industry. Silicon Valley is home to many clean tech and solar companies who are looking for qualified people to work in these new green energy fields. 

This short course will provide an overview of current thin film PV technologies: a-Si, CdTe, CIGS and new emerging PV technologies such as organic dye sensitized solar cells, carbon nanotubes and nanowires. The short course will also cover large scale solar power utilities and concentrated solar thermal technologies such as parabolic troughs, dish engines and power tower as well as thermal storage.

Other than covering state-of-the-art solar technologies, the course will also cover the solar market, local solar companies and their products, and PV applications such as building integrated PV. 

Speaker Bio: 
Dr. William Kao received his BSEE, MSEE and PhD from the University of Illinois Urbana-Champaign. He has worked in the Semiconductor and Electronic Design Automation industries for 30 years holding senior and executive engineering management positions at Texas Instruments, Xerox Corporation, and Cadence Design Systems. 

Dr. Kao has authored more than 40 technical papers and holds several software and IC patents. He was an Adjunct Professor at UCLA Electrical Engineering Department where he taught courses in computer aided circuit design. Dr. Kao is a Senior Member of IEEE, and was one of the founding members of IEEE-Circuits and Systems - Silicon Valley Chapter, where he was Chapter Chair in 2005 and 2006. 

Dr. Kao currently teaches Renewable Energy, Clean Technology and Business Sustainability courses at UC Santa Cruz Silicon Valley Extension, and at the Silicon Valley Technical Institute in San Jose. 

He is on the Technical Advisory Board for Sigma Quest on the topics of Energy and Environment, and Quality Control, and is a consultant for several local Clean Tech companies.

Dr. Kao was the founder and President of CARES (Chinese American Renewable Energy Society), now The Clean Technology Group of the Chinese Institute of Engineers (CIE) USA-SF, where he is currently a Board Member. 

Most recently, Dr. Kao was a Clean Technology consultant for mainland China Government where he taught courses on "Low Carbon Economy" to Chinese government officials; for the Taiwan Ministry of Science and Technology where he was invited to give seminars on Clean Technology, Renewable Energy, and Energy Efficiency at major universities (academia), government research institutions and local industry ; and for the Malaysian Government on 'Emerging Technologies' for a new Knowledge Based Economy. 



Course Title: Smart Grid Architecture and Value Propositions
Course Abstract:
This talk explains the architecture of the electricity grid, the command/control/communication grid, as well as the end-to-end system now being called Smart Grid. It describes some of the well known value propositions, business perspectives, and how the business economics and technical practicalities would work out. This course is meant as an introduction for the business professionals and a contemporary overview for technical practitioners, product developers, system managers and urban planners. 

Speaker Bio: 
Dr. Michael M. Hsieh created the Smart Grid curriculum for UC Berkeley Extension by developing a suite of 6 new courses including "Introduction to Smart Grids", "Energy Transmission and Distribution", "Command and Control Networks", "Metering and Home Area Networks", "Internet of Things", and "Smart Microgrids". Prior to that, he worked at Sun Microsystems Inc. for nearly 20 years where he designed and delivered 3 generations of Sun workstations and servers architected for Cloud Computing, and also designed and delivered 3 generations of UltraSPARC microprocessor chips for powering the Sun platforms. Michael also had 2.5+ years experience in designing Storage Area Network (SAN) switch. Prior to joining Sun, Michael was a lead engineer for designing multiple microcontroller chips used for controlling the embedded systems at Intel and Ford for 7+ years. Michael's current interests include the design and realization of smart grid, smart microgrid, and internet of things, in the digital living and the digital energy era. 



Course Title: Internet of Things in Support of Smart Grid and Smart Cities and More 
Course Abstract: 
The course starts with briefly describing the vision of Smart City and what would be needed to realize and implement such vision. Building on top of the computational needs for supporting Smart City vision, the discussion proceeds to describe how the applications such as Internet of Things as well as Smart Grid will be enabled by Cloud Computing as an infrastructure as well as a service. From there, the concept of M2M and the future Networked Society will be introduced using Smart City as a target application for illustration. The discussion also includes a brief introduction to RFID as it has been the first set of massively deployed application in the Internet of Things arena. 

Speaker Bio: 
Dr. Michael M. Hsieh created the Smart Grid curriculum for UC Berkeley Extension by developing a suite of 6 new courses including "Introduction to Smart Grids", "Energy Transmission and Distribution", "Command and Control Networks", "Metering and Home Area Networks", "Internet of Things", and "Smart Microgrids". Prior to that, he worked at Sun Microsystems Inc. for nearly 20 years where he designed and delivered 3 generations of Sun workstations and servers architected for Cloud Computing, and also designed and delivered 3 generations of UltraSPARC microprocessor chips for powering the Sun platforms. Michael also had 2.5+ years experience in designing Storage Area Network (SAN) switch. Prior to joining Sun, Michael was a lead engineer for designing multiple microcontroller chips used for controlling the embedded systems at Intel and Ford for 7+ years. Michael's current interests include the design and realization of smart grid, smart microgrid, and internet of things, in the digital living and the digital energy era. 



Course Title: Green MBA: Focus on Sustainability 
Course Abstract: 
Profit is only one measure of an organization's success. Business sustainability recognizes that a company's success is measured by a triple bottom line-People, Planet, and Profit. It emphasizes balancing a company's financial health as well as environmental sustainability, quality of work life, ethical practices, and corporate social responsibility. To become business leaders and managers it is important to be guided by meaningful purpose and clear values. One of these key emerging values for both the present as well as the future is Sustainability. This course focuses on the interdependence of environment, economy, and equity-the three Es of Sustainability- focuses on the functions and responsibilities of managers at all levels to develop organized and effective sustainability practices. This short course will provide an overview of the "cutting edge" of sustainable design including the evolution of mindset, processes and tools required for a sustainable future. It will introduce the fundamental concept and knowledge of sustainability, tools to implement them such as Energy Management Systems (EMS), Key Performance Indicators (KPI), and Life Cycle Analysis (LCA), and how to design products for sustainability (D4S). 

Speaker Bio: 
Dr. William Kao received his BSEE, MSEE and PhD from the University of Illinois Urbana-Champaign. He has worked in the Semiconductor and Electronic Design Automation industries for 30 years holding senior and executive engineering management positions at Texas Instruments, Xerox Corporation, and Cadence Design Systems. 

Dr. Kao has authored more than 40 technical papers and holds several software and IC patents. He was an Adjunct Professor at UCLA Electrical Engineering Department where he taught courses in computer aided circuit design. Dr. Kao is a Senior Member of IEEE, and was one of the founding members of IEEE-Circuits and Systems - Silicon Valley Chapter, where he was Chapter Chair in 2005 and 2006. 

Dr. Kao currently teaches Renewable Energy, Clean Technology and Business Sustainability courses at UC Santa Cruz Silicon Valley Extension, and at the Silicon Valley Technical Institute in San Jose. He is on the Technical Advisory Board for Sigma Quest on the topics of Energy and Environment, and Quality Control, and is a consultant for several local Clean Tech companies. 

Dr. Kao was the founder and President of CARES (Chinese American Renewable Energy Society), now The Clean Technology Group of the Chinese Institute of Engineers (CIE) USA-SF, where he is currently a Board Member. 

Most recently, Dr. Kao was a Clean Technology consultant for mainland China Government where he taught courses on "Low Carbon Economy" to Chinese government officials; for the Taiwan Ministry of Science and Technology where he was invited to give seminars on Clean Technology, Renewable Energy, and Energy Efficiency at major universities (academia), government research institutions and local industry ; and for the Malaysian Government on 'Emerging Technologies' for a new Knowledge Based Economy.

.

Print Email